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3Dsolve CEO Richard Boyd to Present at ITEC 2005 Defence, Training and Simulation Conference

Boyd Will Represent 3D Industry Forum (3DIF) in Presentation on Interchange Standards for Simulation Learning

Amsterdam, The Netherlands, April 26, 2005 — 3Dsolve Inc., The Simulation Learning Company, today announced that Richard Boyd, its CEO, has been selected to present at the ITEC 2005 Defence, Training and Simulation Conference. The ITEC 2005 conference takes place at the Amsterdam RAI International Exhibition and Congress Center in the Netherlands from the 26th through the 28th of April 2005.

ITEC is Europe’s only dedicated conference and exhibition for defence training, education and simulation. The event will focus on lessons learned, latest technologies, case studies, and strategy models in training and education, and modeling and simulation. Boyd is one of the training and education experts from several countries, government agencies, and industry selected to craft a world-class conference program.

Stan Jacobson, ITEC 2005 Conference Chairman said, “I am delighted that Richard Boyd is available to provide the conference delegates with insight into the evolving standards for 3D objects and how this will impact the training solutions available to military personnel.”

In his presentation, Boyd will focus on how new 3D standards are helping interactive 3D graphics successfully make the leap from entertainment to mission critical department of defense applications. He will discuss how the development of 3D simulation models based on industry standards can result in more successful and cost effective training for the military and other organizations.

“Any corporate executive or military leader who watched children weaned on PlayStation and Nintendo came away with higher expectations for their next simulation learning or marketing application,” explained Boyd. “The acceptance of new industry standards can help meet these expectations by dramatically increasing the number and quality of highly interactive applications where 3D models are completely integrated with the business applications and data that give them realism, value and context.”

About ITEC 2005
ITEC is Europe’s only defence training, education and simulation exhibition of products, applications, and technology. The event brings together leading suppliers of training solutions, over 370 delegates from high levels of government, military and industry, and more than 2500 defence training attendees from over 50 countries. For more information, visit HYPERLINK "http://www.itec.co.uk" http://www.itec.co.uk.

About 3DIF
The 3D Industry Forum was formed in 2002 by Intel, Adobe, Boeing and a group of CAD and DCC companies to create the Universal 3D file format, or U3D, and overcome the last barrier to helping businesses take full advantage of today’s faster processors and networks to incorporate interactive 3D graphics into a host of applications. Today there are more than 30 companies involved in 3DIF, whose charter is to actively “promote 3D technologies and standards, define conformance testing and compliance, and provide a point of contact for ongoing 3D activities and development”. The U3D format has been approved by ECMA International, the standards body that manages the DVD standard among others, and is in committee to sponsor the format for ISO certification.

About 3Dsolve
3Dsolve, The Simulation Learning Company, creates collaborative simulation learning solutions for government, military, and corporate applications, a market estimated to reach $6.1 billion by 2006. 3Dsolve’s simulation learning products use realistic, interactive 3D graphics, based upon industry standards, enabling users to learn by doing. In each of the last two years, 3Dsolve has been named as one of Military Training Technology magazine’s Top 100, the “companies that have made a significant impact in the military training industry.” 3Dsolve’s headquarters are in Cary, North Carolina, near world-renowned Research Triangle Park.

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Dana Cowley
ClearImage
dana.cowley@clearimagepr.com
919.863.2393 x 217

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